Background Summary/Objective
Obtain a position in Process/Development Engineering to utilize and grow my technical skills and also provide me with opportunities for advancement and personal development.
Experience in semiconductor (Si and GaN) manufacturing environment; strong analytical ability, excellent communication skills and innovative root cause problem resolution.
Experienced and detail knowledge of various semiconductors manufacturing processes i.e. Photolithography, thin film depositions (ebeam, sputtering and ALD), wet and dry plasma etches.
Experience in Statistical methods of data analysis (SPC and DOE).
Education
B.S. Electrical Engineering, Portland State University, Portland OR (June 2008)
A.S. Engineering, Clark College, Vancouver WA (June 2004)
Professional Affiliations
•Institute of Electrical and Electronics Engineers (IEEE)
•Member of International Honor Society of the Two-year College
Technical Skills
•Lean Manufacturing
•SPC (Statistical Process Control)
•DOE using JUMP(Design of experiment)
•Hardware:
oAMT and ASM reactor operation growing Epitaxial Silicon wafers
oTest equipments such as Oscilloscope
oTools and Metrology equipments usage in Fab (Semiconductor)
•Language skills: English, French
•Behavioral: Strong team orientation, fast learner, communication skills
WORK
EXPERIENCE:
Process Development Engineer October 2011 – Present
Transphorm, Goleta, CA
•Work with team of scientists, engineers, and technicians to develop fabrication processes for advanced GaN-based electronic devices.
•Conduct periodically qualification on tools, making sure that all measurements stay within the tools specs.
•Wafers disposition.
Senior Process Eng. Technician May 2010 – September 2011
Transphorm, Goleta, CA
•Worked as a Senior Process Eng. Technician in an early stage start-up company supporting R&D engineers and processing of semiconductor (GaN) in a clean room environment from the front-end to the back-end process. I’m certified in chemical wet etch and Dry etch (Plasma Therm); metal and dielectric deposition (e-Beam CHA, Sputter PERKIN 400, PECVD Novellus and ALD Oxford flexAl); Metal LIFT-OFF; Photolithography (Coat, Exposure, Develop, Overlay and Defect Inspections); Visual Defect Inspection using microscope; Metrology (AFM, Ellipsometer, Nanospec, Veeco Dektak Profiler) and Auto Probe (PCM, Switching and DC testing).
•Support Engineering and Development on an “as needed” basis to perform basic tests and non-standard processing.
•Conduct periodically qualification on tools, making sure that all measurements stay within the tools specs.
•I monitored and inspected product run operations, using metrology equipments and microscopes, to determine control and output quality of each process, and where applicable, isolate any spec violation issues and tolerance margins.
Semiconductor Technician II Feb 2009 – Apr 2010
Honeywell Aerospace, Redmond, WA
•First, I worked as a contractor for Manpower and became a permanent full time employee for Honeywell, worked in a clean room environment under the MEMS division. Perform various silicon and glass wafer processing steps as assigned; include working with hazardous chemicals, operating and maintaining complex automated equipment used...
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