Solutions oriented and analytical with high degree of confidence and history of success contributing to reliable,
World class Power Electronics, EMI/EMC, Analog, Digital, PCB designs and products regulatory certification.
Adept at readily gathering and translating complex and stringent requirements into viable solutions. Strong
background in hardware Electrical and Electronics products designs and proficiency with laboratory test and
Measurement tools. Cost-conscious, implement time saving measures to optimize production. Excel at collaborating
across departments, coordinate with staff, senior management and customers to manage and complete the projects
on time and within the budget with highest quality.
Engineering and Technical Design Expertise skills Summary:
Hardware Interfaces: SPI, I2C, CAN, 4 to 20mA, RS-232, RS-485, USB, Ethernet.
PCB Designs: PCB material selection, Layer stack up, PCB Components placement and routing to achieve the best
EMI-EMC performance, Signal Integrity, PCB layout techniques and grounding/shielding implementation practices,
Creepage and clearance calculations, Grounding of high speed mixed Signal PCBs, PCB layout floor planning,
Multilayer designs, Ground Loops, PBA 3D model review.
Analog: Analog front end signal conditioning, Control Loop Design, RFID Reader, Micro pumps control, Solenoid valve
control, Sensors selection, Opto isolators selection and circuit design, Hall effect sensor, Current Transformer design,
Multivibrator Circuit, Precision current source circuit, signal Conditioning and interface such as Current, Voltage,
Temperature sense and monitoring circuits, Noise mitigation and analysis, Electro-Mechanical components interface.
Digital: Microcontroller selection and interface 32bit: MCF51EM256, TMS470R1B1M, AT91SAM9260-CJ, LPC2368,
LPC2388, 16bit: PIC24FJ192GB106, GC-EX-184B, MSP430, 8bit: SAB 80515, ATmega1281V-8AU, PIC16F, PIC18F,
Digital Signal Controller selection and interface 32bit: TMS320F28335, RTC selection and interface, Memory
Interface (Flash, SDRAM, EEPROM, MRAM), IO port pin expander interface, Digital Potentiometer interface,
Watchdog Timer Circuit, Graphical LCD interface, DSP, LED driver, BDM interface, Embedded Control System, Opto
Isolation for Bidirectional Communication, Power line Communication, Ethernet communication, GSM.
Mixed Signals: ADC selection and interface, ADC Characterization, DAC selection and interface, Wireless
Communication, Intrinsic Safety Isolation barrier for 4 to 20mA and RS485.
Power Electronics: Flyback and Forward topology 1Phase and 3 Phase SMPS, Motor Drives designs 1.5kW to 630kW
based on IGBT and GTO (IGCT), Resolver interface, Inverters, 1 Phase and 3 Phase Electricity Meter, UPS, Gate Drive
design and Opto couplers Interface, Power Management, Magnetics design, Switching Power Supply design, Snubber
design, Protection circuitry design, Isolated and Non Isolated Power supply, EMC filter design, EMI Filter design, 1
Phase and 3 Phase Trivector Meter, Switched Capacitor Voltage Converter, Current Mode PWM Control, Flyback
Transformer design, Potential Transformer design, Telecom Transformer design, Common Mode Choke design, Buck
Switching Power supply design, Triac, SCR, MOSFET Driver circuitry design, Battery charger, Fuel gauge interface,
Stepper motor drive, Power line Coupler design, Power loss characterization, HVAC, Thermal design, Redundant
Power Supply design.
EMI/EMC: Designed and very much familiar in EMI/EMC design concepts, Electrical Fast Transient /burst (EFT)
immunity, Electrostatic Discharge (ESD) immunity, Radiated Radio-frequency electromagnetic field immunity/
Susceptibility (RS), Surge immunity, Immunity to conducted disturbances induced by radio-frequency fields (CS),
Radiated Emission (RE), Conducted Emission (CE), Power frequency magnetic field immunity, EMI/EMC analysis.
• I have designed and tested for the products (Projects 1 to 18) listed in experience highlights section for 100% EMI and EMC compliance.
• Analyzed conceptual product designs for EMI and EMC risks mitigation and contingency plans.
• Components selection, schematic design, PCB layer stack up, PCB components placement and routing, review of mechanical components and enclosure, EMI and EMC reviews to meet the stringent EMI and EMC specifications.
• Developed designers reference manual for designers.
• Designed and tested the products for ESD test per EN/IEC 61000-4-2 of test level up to 20kV contact discharge and 40kV air discharge.
• Designed and tested the products for RS (RI) test using GTEM cell and Anechoic chamber per EN/IEC 61000-4-3 of test field strength up to 40 V/m.
• Designed and tested the products for EFT test per EN/IEC 61000-4-4 of test level up to 5kV on Power lines and 2.5kV on I/O lines (Capacitive coupling).
• Designed and tested the products for Surge test per EN/IEC 61000-4-5 of test level up to 10kV.
• Designed and tested the products for RE and CE tests per EN/IEC 61000-4-6, CISPR11, CISPR22 Class A ITE, Class B ITE and FCC part 15.
• Designed and tested the products for Environmental Conditions and Tests for Airborne Equipment per RTCA DO-160F
• Simulated the EMC tests using Cadence Allegro Design Entry HDL.
• Expertise in providing technical consultancy to other teams in the organization in the area of EMI and EMC and any other design issues.
• Conducted training on “Components selection and Design” for 40+ expert electronics hardware and Mechanical engineers.
• Conducted training on “Design Challenges to meet stringent EMI, EMC & Safety requirements” for 30+ EMI and EMC expert engineers.
Safety Design: Intrinsic safety Design, Product UL Safety design.
Software Tools: MS Office (Excel, Word, PowerPoint, Outlook, Project, Visio etc.).
Protel 99, Altium designer winter 09, Cadence Allegro Ver 16.5, Orcad, PCAD 2004, Zuken Cadstar, Mentor Graphics
PADS Layout SPac2 and Mentor Graphics PADS Logic SPac2.
PSpice simulation, LTSpice, MATLAB, HyperLynx, Cadence Allegro Design Entry HDL.
Visual Source Safe Ver 6.0 (VSS), DOORS.
Exposure to C language, MPLAB IDE Ver 8.43 and CodeWarrior IDE Ver6.2
Standards Compliance: IEC 61000-4-X, IEC 60079-11, IEC 60950-1, IEC 61010-1, IEC 62053-11, IEC 62053-22, IEC
62053-23, IEC 62056-21, IEC 60529, IEC60947-4-1, IEC 61326-1, CISPR 11, CISPR 22, UL 60079-11, UL1008, UL 60950-
1, UL 61010-1, ANSI C12.20, ANSI C37.90.1, RTCA/DO-160F, RTCA/DO-254, EN 55011, EN 55022, EN 300440, EN
301489-1, EN301489-3, EN60950-1, FCC part B, FCC part C, ISO15693, CENELEC EN 50065-1, CBIP 88, IS 13779.
General Designs and Quality: Worst case analysis for semiconductors and passive components, CMMI Level 5 Ver
1.2, Modular Design mathematical calculations of schematics, Design/Preparation, Review and release of
requirements, schematics, BOM, high level and detailed Design document, PCB, Gerber, SMT, Module test plan,
Sy...
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