5+ years experience in semiconductor device engineering and process development
5+ years clean room experience, micro/nano fabrication
3+ years experience using test instruments and LabView programming
3+ years teaching and training experience
Education:
Northeastern University (MA)– MSc- PhD candidate, Electronics Engineering, 2008-2013
Area of Concentration: Electronic Circuits and Semiconductor Devices GPA: 3.7/4
Thesis: Fabrication and characterization of pentacene Field Effect Transistors (OFET)
• Designed an optical mask using Coventorware to reduce the contact effects
• Process development for fabricating the Pentacene field effect transistors
o Coated the persistent Pentacene by thermal evaporation or spin cast
• Test Engineering - Characterized the devices using parameter analyzer and LabView
• Analyzed the film properties by taking SEM /AFM images of the thin-films and crystals
Graduate courses: MEMS, Analog Integrated Circuit Design, Advanced VLSI Design, ICs for
Communications and Mixed, Signal Processing (mixed signal RF IC), Solid State Devices
Integrated Circuit Fabrication, Electronic Materials, Optical Spectroscopy Methods, Classical
Control Systems, Linear Systems
University of Birmingham (UK)–Undergraduate (MEng), Electronics Engineering, 2004-2008
Area of Concentration: Electronics Circuit and Semiconductor Devices GPA:3.8/4
Thesis: Novel way of predistortion linearization of Doherty power amplifier
Work experience:
-Research Assistant, Kostas Center; Boston MA 2008-2013
-Fabrication and characterization of organic TFTs
-Designed and assembled an organic thermal evaporator
-Reviewed the literature for nano-memories funded by EMC corp.
-Teaching Assistant, ECE department, Northeastern University 2010-2013
-Supervised students to build an infrared remote controller to be functional over 200ft
-Supervised students to fabricate a micro pump and 3D assemble of CNTs
Skills:
Device fabrication oxidation, spinners, photolithography, e-beam lithography (EBL), soft lithography (PDMS), inductively coupled plasma RIE (ICP RIE), wet etching, sputter deposition, e-beam and thermal evaporation, ion mill, wire bonder, XeF2 silicon etch system, chemical mechanical polishing (CMP) tool
Test instruments network Analyzer, spectrum analyzer, semiconductor...
Login or Register to view the full resume.
