Passionate about working on best-in-class chip fabrication processes and products
Core Skills or Competencies:
Process Engineering / Application Technology
Summary
• Drove results and achieved process expertise in development, process control, and manufacturing of semiconductor, photonics, display, and disk drive products using thin film deposition of single layer alloys and multilayers (metals, dielectric) including PVD (DC, RF, and dual ion beam sputtering, e-beam evaporation),
PECVD, Cu electrochemical deposition, wet etch, chemical mechanical polishing (CMP), and plasma etch.
• Demonstrated process feasibility and process equipment reliability by working with customers (demo / JDP,
wafer marathons).
• Delivered solutions in process development / process control, manufacturing, and reliability / failure analysis.
• Managed tool ownership responsibilities to successfully reduce tool downtime / increase wafer process uptime
to enhance productivity.
• Developed higher yield, higher throughput processes required for new process / product introduction and manufacturing.
• Collaborated with suppliers, vendors for process development and to ensure desirable process quality.
• Implemented use of DOE, SPC, Six Sigma, and data analysis tools JMP / Excel to minimize development time, control processes, and analyze results.
• Solved customer issues via root cause analysis and corrective action by using Ishikawa diagrams and 5 Whys Technique.
• Accomplished in delivering results in fast paced start-up environment as well as large companies.
METROLOGY/THIN FILM CHARACTERIZATION / MATERIALS ANALYSIS skills include characterization of thin films for their structure, magnetic properties, electro-/ magneto-transport properties, optical properties, composition, thickness, stress, and stoichiometry.
Surfscan, Four-point Probe, X-ray Diffraction, Electron Microprobe, Scanning Electron Microscopy, Spectrophotometry, Atomic Force Microscopy, Ellipsometry, Transmission Electron Microscopy, Interferometry, Stress Measurement, Profilometry. SIMS, RBS, XPS via Charles Evans.
Professional Experience
Customer Application Technologist – Chemical Mechanical Planarization 2011 -
Applied Materials
• Driving customer demonstrations, marathons, and projects in oxide CMP process to solve customer (US, Korean, Taiwanese, and Japanese) issues, demonstrate feasibility of CMP process, and reliability of CMP process equipment.
• Spearheading efforts to improve internal oxide chemical mechanical polishing (CMP) process knowledge by carrying out experimental process work with oxide chemical mechanical polishing Technology Manager and his group of process engineers.
• Delivered results in process and metrology towards successful completion of two live Tungsten demonstrations for Toshiba that has led to sale of two CMP tools worth $4 M.
• Accomplished as part of a team in solving Global Foundries and IBM Copper and Tungsten CMP process issues by providing possible process solutions / suggestions over the phone and via e-mail.
Sr. Process Engineer / MTS – Process Engineer 2008 – 11
Finisar Corporation
• Drove results in process development / control, failure analysis and metrology of e-beam evaporated thin films
for optoelectronic devices.
• Led process development and process control of anti-reflective (AR) and high reflectance (HR) coatings on laser facets for manufacturing of laser product.
Process Development / Process Control Engineer 2005 – 08
IBM, T.J. Watson R...
Login or Register to view the full resume.
