DEVELOPMENT, PROCESS, PACKAGING ENGINEERING LEAD
Key Areas of Expertise
Materials Chemistry QA/ QC/ SPC /JMP ;Polymer Science and Coatings
&; Process Development ;Six Sigma and Lean MFG ;Project Management
;Scale-Up/Product Introduction ;Reliability, UL, IEC ▪Formulation Development
;Personnel Training and Management ;Adhesives ;Budgeting/Scheduling
; New Tool Specification/Qualification ; Failure/Root Cause Analysis
; Vendor Relations ; Production Analysis and Management
; Design of Experiments ; UV cured materials
Highlights of Qualifications and Skills
•Highly motivated, process/development, failure analysis, quality, product development engineer with a dependable work ethic and extensive experience cultivating and developing materials and processes for high-tech products.
•A skilled production analyst, strategic thinker with an instinct for identifying opportunities, developing strategy that drive results, and build market value.
•Recognized for creative approach to product development that routinely results in enhanced customer satisfaction through process efficiency and new product introductions.
•A tenaciously problem solver with excellent decision making skills and an intuitive ability to identify unexplored opportunity for technical or production design.
Professional Background and Accomplishments
Ascent Solar, Thornton, Colorado (Dec 2011 to current)
Patterning Cell, Packaging, Final Assembly Process/Development Engineering Lead
Patterning Cell, Quality, Metrology Process/Development Engineering Lead
Patterning Cell Process/Development Engineering Lead
Sr. Development and Process Engineer
After raising process yield from < 50% to > 90%, promoted to patterning cell lead. Lead patterning team including the performance of several engineers and support employees, controlled budgets, and ensured the continual maintenance, process improvements and efficient operations of process engineering team for laser scribing, dielectric printing, silver printing, failure analysis, metrology, documentation, reliability, visual inspection and factory yields. Transitioned from quality group lead to begin building an engineering team for packaging and final assembly focusing on new thermoset and thermoplastic adhesives and materials for final products
•Led hands-on tool modifications of dielectric ink-jet printer that increased process yields by over 50%, reduced downtime by 25% and saved Ascent over $250,000 in maintenance and scrap costs annually
•Led engineering team in co-development of a new dielectric ink/paste and low heat UV cure allowing for the replacement of $5 million ink-jet toolset by a $200k screen printer with higher capacity, higher reliability and requiring fewer technical personal
•Led Engineering team that instituted centralized documentation procedures, approval process for engineering experiments, gage R&R studies, change control notifications, SPC review, controlled modules quality (including reliability according to UL and IEC standards) and release to customers
•Lead daily metrology and failure analysis teams to drive electrical tests yields from less than 30% to greater than 70%
•Developed component level stress tests for screening new materials, determine root cause failures and quantifying reliability through accelerated tests for current materials, including Pull, SEM, EDS, thermal
•Developed shipping process for moisture sensitive solar cells including barrier bags, sealing and desiccants
•Developed lamination procedures for thermoplastic encapsulants used in solar cell packaging to reduce process times by 50%
•Lead lamination process development that reduced adhesive materials waste by 15% by redesigning materials layout
•Routinely trained staff in process effectiveness (DOE, root cause analysis, structured problem solving (six-sigma methodology,), lean), team dynamics, collaborative partnership, lean manufacturing and communication skills
•Developed incoming inspection procedures for insulating and conductive pastes including both rheology and electrical functionality
•Managed numerous vendor relationships, outlined and negotiated partnership and contract agreements for tooling and suppliers
•Developed tooling proposals, cost analysis and factory yields/capacities including presenting to senior leadership and Board of Directors
Hewlett-Packard Co. San Diego, CA (May 2006 to Nov 2011)
Development Materials Scientist/Chemist
Developed, scaled and supported thermoset and thermoplastic polymeric, hybrid and inorganic materials for use in commercial print industry. Partnered with mechanical engineering team to solve technical problems at the root cause using innovative engineering methods and implement materials science solutions to enable lifespan and quality requirements. Worked with external vendors to scale processes from bench top to volume manufacturing including quality systems and SPC.
•Lead team tasked with reengineering a new printer paper path roller that ultimately reduced cost by 25%, increased lifespan by a factor of 10 and was completed ahead of schedule
oReengineering steps included working with customers and marketing, troubleshooting/failure analysis, developing technical specifications, developing accelerated component level tests, sc...
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